Cinterion Wireless Modules has announced its new AGS3 automotive module at CTIA Wireless 2010. The new module strengthens Cinterion’s market-leading M2M product portfolio, adding land grid array (LGA) technology to its automotive grade modules.
AGS3, Cinterion’s sixth generation automotive module, is optimized for peak performance and rugged automotive application environments. It includes solderable LGA surface mounting technology for efficient, fully automated manufacturing and process consistency as well as advanced telematics features and functionality.
AGS3 meets the requirements of the European eCall initiative and is ideal for ITS applications such toll collect, telematics, fleet management and emergency call and roadside assistance solutions.