ROHM Semiconductor, a group company of the Japanese semiconductor manufacturer ROHM, will provide its 2-in-1 silicon carbide (SiC) molded module, the TRCDRIVE pack, to Valeo, a Paris-based company designing future powertrain solutions. The announcement marks the first step toward a deep collaboration to optimize the next generation of power modules for electric motor inverters – leveraging their combined expertise in power electronics management.

Valeo itself is working to broaden access to efficient, electrified mobility across various vehicle types and markets – from e-bikes, through to passenger cars, and even e-trucks. By pairing its expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo is looking to drive the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide.

The companies have been collaborating since 2022, refining power electronics to deliver higher energy efficiency, reducing heat with optimized cooling and mechatronic integration, and increasing overall reliability with SiC packaging – ultimately aiming to offer optimized cost-performance solutions. These evolutions will work mutually to help the companies support the growing demand for longer-range, faster, charging capabilities and for overall affordability, high-performance, and an affordable inverter for BEVs and PHEVs.

Valeo confirmed its plans to start supplying its first series project in early 2026. Together, Valeo and ROHM will help improve the efficiency and downsizing of Valeo’s next generation of xEV inverters.